New Boron Deposition Model Based on Thin Oxide Film in Process of High Frequency Transistor
Authors
Kim Chaek University of Technology, Pyongyang, Democratic People’s Republic of Korea (Korea)
Sariwon College of Technology, North HuangHae, Democratic People’s Republic of Korea (Korea)
University of Science, Pyongyang, Democratic People’s Republic of Korea (Korea)
Pyongsong University of Education, South Pyongan, Democratic People’s Republic of Korea (Korea)
Article Information
DOI: 10.51584/IJRIAS.2025.100900097
Subject Category: Education
Volume/Issue: 10/9 | Page No: 988-994
Publication Timeline
Submitted: 2025-08-16
Accepted: 2025-08-23
Published: 2025-10-25
Abstract
This paper reports new deposition model of boron impurity considered formation of oxide film during deposition process. Finally, we have considered the impurity concentration change in silicon surface and found that diffusion coefficient in the thin oxide film increases more 100 times than the thick oxide film. The result contributes to get the accurate simulation value. This new boron deposition model will apply to find the formation condition of base layer in fabrication process of high-frequency transistor.
Keywords
Boron impurity; Deposition model; Concentration distribution; Diffusion coefficient
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References
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